| Author(s) | M. Alahmad and F. Abd El-Aleem |
| Affiliation | Department of Chemical Engineering, College of Engineering King Saud University, P.O. Box 800, Riyadh 11421, Saudi Arabia Fax (9661 – 4678770) |
| Title | Heat Transfer Challenges in Semiconductors Processing and The Applications of Heat pipes for Efficient Heat Removal |
| Source | Journal of King Saud University. Engineering Sciences. Volume 15, No 1. (2003/1423) |
| Abstract | Abstract. The rapid developments in electronics and semiconductors processing led to the use of very compact and precise units with relatively large power and excellent performance. But still the temperature sensitivity and control of such special materials are pronounced and hence its cooling is essential for better performance and smooth operation. Moreover, the dimensions of these electronic components are small and the surface available for heat transfer is also small. Hence, compact cooling means are necessary for effective heat removal from these sensitive materials. In the present work, various cooling technologies applied in electronic systems are analysed and discussed in view of their cooling potentials and compactness necessary by semiconductor systems. The heat pipe technology was selected in the present work as an efficient tool for heat removal from electronic chips due to its direct cooling via phase change of the working fluid inside and without any external pumping power. Simplified design calculations are given in the paper for the selected copper-water heat pipe for themal cooling of an electronic system. |
